SIE.5:5 - Archetypal Grounding - Semiconductor Recall Trace
A recall-triage query crosses a wafer identifier from a fabrication source, die coordinates, device serials, package identifiers, supplier lot identifiers, GS1 event identifiers, and an enterprise material master. The receiving question is whether a shipped device can be traced to an affected fabrication lot.
| Endpoint question | Constructed disposition |
|---|---|
wafer W-204 and supplier lot L-88 | not identity; the supplier record asserts that the wafer is a member/output associated with the lot under a bounded process interval. Preserve both identifiers and relation provenance. |
die coordinate (x17,y9) on wafer W-204 and device serial D-771 | same physical die/device at the selected post-singulation grain only when the packaging event and issuer records connect them; accepted with interval and event evidence. |
device serial D-771 and package code P-55 | unresolved because the package identifier is reused after rework and the event history lacks effectivity. Stop the dependent trace branch. |
enterprise material master M-12 and device serial D-771 | family/type membership, not individual identity. The master describes a material/product class and authoritative enterprise attributes within its stewardship scope. |
GS1 event E-901 and device D-771 | event and object are different entities; the event may concern the device. Never merge their identifiers. |
Tests cover reused package identifiers, a die split/merge error, contradictory supplier events, a missing cross-enterprise link, and a later correction. The interface returns supported trace segments and the unresolved P-55 branch. MDM or the domain steward may later decide a master identity; SIE.5 has not done so.